光掩模
光刻
平版印刷术
光刻胶
薄脆饼
极紫外光刻
光学
下一代光刻
计算光刻
X射线光刻
材料科学
无光罩微影
光电子学
抵抗
纳米技术
电子束光刻
物理
图层(电子)
标识
DOI:10.1002/9781119867814.ch12
摘要
Photolithography is to make device patterns on the surface of semiconductor substrate. During photolithography, ultraviolet light passes through the pattern windows of the mask, and the intensity that the photoresist receives is uniform. This chapter discusses the lithography process. In the lithography process, the design of photomask is also an important topic. The chapter focuses on the alignment mark on the mask used for manual alignment. Several points need to be considered in the design of the alignment mark, which are often encountered in university laboratories and clean rooms. To avoid absorption, the light system of an extreme ultraviolet lithography machine adopts a reflective mirror structure, and the photomask also adopts this structure. The optical system is placed in a vacuum chamber, and the wafer and the mask are also placed in a vacuum chamber.
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