浪涌
碳化硅
材料科学
电流(流体)
肖特基二极管
二极管
光电子学
可靠性(半导体)
功率(物理)
电子工程
电气工程
功率半导体器件
肖特基势垒
核工程
宽禁带半导体
电涌放电器
工程物理
瞬态(计算机编程)
硅
温度测量
作者
Bin Zhang,Hongliang Zhang,Zi'ang Zhao,Qiang Liu,Fanpeng Zeng,Yingxin Cui,Mingsheng Xu,Xiangang Xu,Handoko Linewih,Jisheng Han,Yu Zhong
摘要
Abstract The surge current capability is one of the important key parameters for the application of silicon carbide (SiC) Schottky barrier diode (SBD) in power converters. A comparison is conducted between the surge current capability of single-chip packaged SiC SBD and dual-chip packaged SiC SBD. The result indicates that the dual-chip SBD with the same power have a higher non-repetitive surge current limit. This article also focuses on the prediction of non-repetitive surge current limits for dual-chip packaged SiC SBDs using an electrothermal model. The simulation and the actual device test results are matching well within 2.8 % margin. Thus, it represents this simulation model that can be applied to predict the surge current capacity of the dual-chip packaged SiC SBD.
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