Microstructural characterization of TC4/Cu/ZQSn10-2-3 diffusion bonded joints

The experimental investigation on the diffusion bonding of TC4 to ZQSn10-2-3 was carried out in vacuum. CuSn3Ti5,Cu3Ti and rich-Pb layer were formed at the interface zone. The maximum joint strength was 102 MPa. Brittle fracture was explored after shear test,and occurred proximity to ZQSn10-2-3 side. Using copper as the interlayer,element Sn and Pb can be avoid diffusing from ZQSn10-2-3 to TC4. Then there were little CuSn3Ti5 in the interface. Fracture had certain plasticity,and the maximum strength of joint was 196 MPa. The optimum bonding parameters were:bonding temperature T=830 ℃,bonding pressure p=10 MPa and bonding time t=30 min.