Highly integrated multiplexed microscopy system for integrated circuit failure analysis

In this paper, we present an optical multiplexing structure designed to develop a highly integrated, non-contact, non-destructive inspection system for integrated circuit failure analysis or semiconductor defect detection. This system comprises four subsystems: a bright-/dark-field microscope subsystem, an emission microscope subsystem, a laser confocal scanning microscope subsystem, and a fluorescence confocal microscope subsystem. The functionality of the system is verified and analyzed using avalanche photodetectors. The detection process involves sequential steps: locating the light-emitting devices, performing 3D imaging to assess damage, and comparing fluorescence lifetimes among the devices to analyze the failure mechanisms. This multimodal detection approach enables rapid and accurate identification of production issues, facilitating the tracing of root causes for failures.