执行机构
材料科学
绝缘体上的硅
薄脆饼
光学
微电子机械系统
反射器(摄影)
变形镜
制作
光电子学
活塞(光学)
波前
硅
物理
电气工程
工程类
医学
光源
替代医学
病理
作者
Il Woong Jung,Uma Krishnamoorthy,Olav Solgaard
标识
DOI:10.1109/jmems.2006.876666
摘要
In this paper, we present a high fill-factor micromirror array actuated by self-aligned vertical electrostatic combdrives. To meet the requirements of applications in free-space communication and imaging, each micromirror has three degrees of freedom of motion: rotation around two axes in the mirror plane and linear translation perpendicular to the mirror plane. Our approach is to integrate the high fill-factor reflectors into the fabrication process of the actuators on the wafer-scale. Multilevel silicon-on-insulator (SOI) bonding is utilized to form the high optical quality reflectors and high aspect-ratio vertical combdrive actuators. The wiring for electrical access to the multielectrode per pixel array is fabricated on separate wafers by thin film processing, and flip-chip bonded to the reflector/actuator chip. This architecture overcomes the fill-factor limitation of top-side accessed electrical addressing of mirrors made on SOI. Our 360/spl mu/m pixel size mirror array achieves a 99% fill-factor with optically flat reflectors.
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