Hybrid additive manufacturing of an electron beam powder bed fused Ti6Al4V by transient liquid phase bonding

材料科学 金属间化合物 微观结构 扩散焊 合金 等温过程 母材 钛合金 冶金 复合材料 同质性(统计学) 剪切(地质) 统计 物理 热力学 数学 焊接
作者
Hamid Reza Ghorbani,Mohammad Hossein Mosallanejad,Masoud Atapour,Manuela Galati,Abdollah Saboori
出处
期刊:Journal of materials research and technology [Elsevier BV]
卷期号:20: 180-194 被引量:14
标识
DOI:10.1016/j.jmrt.2022.07.009
摘要

Hybrid Additive Manufacturing (HAM) is a production strategy enhancing the flexibility of the already versatile Additive Manufacturing (AM) techniques. AM of Ti6Al4V, on the other hand, has been of great interest to numerous research works, thanks to the unique corrosion, biomedical and mechanical properties of the alloy. Hence, this research marks the first report on the HAM of Ti6Al4V by Transient Liquid Phase (TLP) bonding of an Electron Beam Powder Bed Fused (EB-PBF) sample to a conventional one. A copper interlayer was used for bonding, and the TLP process was performed at 890 °C and 970 °C for 60 min. Shear strength test was carried out and the results showed the highest shear strengths of 579.3 and 662.5 MPa for TLP bonding at 890 °C and 970 °C, respectively. By increasing the bonding temperature to 970 °C, no Cu-rich phases were observed in the microstructure, as opposed to the 890 °C samples, and a complete isothermal solidification without intermetallic phases was achieved. Moreover, the 970 °C TLP sample was featured with a much better microstructural integrity and homogeneity in both the base metals and the bonded zone. TLP bonding at 970 °C resulted in a more ductile fracture surface than that bonded at 890 °C. The strong differences between the two TLP bonds were primarily attributed to the faster diffusion rate of elements along the joint and base metal at higher temperatures.

科研通智能强力驱动
Strongly Powered by AbleSci AI
科研通是完全免费的文献互助平台,具备全网最快的应助速度,最高的求助完成率。 对每一个文献求助,科研通都将尽心尽力,给求助人一个满意的交代。
实时播报
1秒前
xbt发布了新的文献求助20
1秒前
Neptune发布了新的文献求助10
2秒前
科研通AI6.2应助哈哈哈采纳,获得30
2秒前
諵来北往发布了新的文献求助10
3秒前
3秒前
5秒前
6秒前
柳成荫发布了新的文献求助10
7秒前
8秒前
8秒前
我是老大应助天真的以亦采纳,获得10
9秒前
核桃发布了新的文献求助10
10秒前
10秒前
万能图书馆应助沈格采纳,获得10
10秒前
小生不才完成签到,获得积分10
11秒前
脑洞疼应助諵来北往采纳,获得10
11秒前
WXY完成签到 ,获得积分10
11秒前
邓六一完成签到,获得积分10
12秒前
dcc完成签到 ,获得积分10
12秒前
xiaolizi发布了新的文献求助10
13秒前
14秒前
小媛发布了新的文献求助10
14秒前
小蘑菇应助踏实的千柔采纳,获得20
14秒前
malen111完成签到 ,获得积分10
15秒前
duanzhuang完成签到,获得积分10
16秒前
18秒前
xuejingling应助长春陈冠希采纳,获得10
21秒前
22秒前
罗ning发布了新的文献求助10
22秒前
22秒前
共享精神应助云霓采纳,获得10
22秒前
23秒前
24秒前
25秒前
25秒前
27秒前
flyy完成签到 ,获得积分10
27秒前
李健应助xinyuli采纳,获得10
30秒前
XBJ发布了新的文献求助10
31秒前
高分求助中
(应助此贴封号)【重要!!请各用户(尤其是新用户)详细阅读】【科研通的精品贴汇总】 10000
Nondestructive Testing Handbook: Vol. 4, Thermal and Infrared Testing (IR), 4th ed 800
作者名:Kristopher P. Plain,悉尼大学的,目前只能查到其四篇论文,想找到其博士论文 590
Évora na Idade Média 555
Soil mites of the family Rhagidiidae (Actinedida: Eupodoidea). Morphology, Systematics, Ecology 520
Matrix Methods in Data Mining and Pattern Recognition Second Edition 510
Stratospheric Ozone: A Textbook 500
热门求助领域 (近24小时)
化学 材料科学 医学 生物 纳米技术 工程类 有机化学 化学工程 生物化学 计算机科学 内科学 物理 复合材料 催化作用 细胞生物学 无机化学 光电子学 物理化学 电极 基因
热门帖子
关注 科研通微信公众号,转发送积分 7361770
求助须知:如何正确求助?哪些是违规求助? 8971151
关于积分的说明 19068941
捐赠科研通 7007799
什么是DOI,文献DOI怎么找? 3223402
关于科研通互助平台的介绍 2387065
邀请新用户注册赠送积分活动 2204152