高电子迁移率晶体管
钝化
材料科学
电气工程
纳米技术
电压
图层(电子)
晶体管
工程类
作者
G. Purnachandra Rao,Nistha Baruah,Trupti Ranjan Lenka,Rajan Singh,Nour El I. Boukortt,Hieu Pham Trung Nguyen
标识
DOI:10.1109/edkcon56221.2022.10032868
摘要
In this research article, the influence of AlGaN back-barrier on the device performance has been analyzed. The study has been conducted based on the effect on the breakdown characteristics and RF performance. The inclusion of back barrier helps to raise conduction band, which diminishes the leakage path below the buffer layer and also helps to contain the 2DEG in the narrow channel. Furthermore, the RF performance is improved by mitigating the conduction losses and short channel effects. The device having the features of Si 3 N 4 passivation, recessed gate structure and the substrate used is β-Ga 2 O 3 . The enhancement in breakdown voltage, RF performance (f T & f max ) with the presence of AlGaN back barrier in proposed III-Nitride Nano-HEMT on the preferred β-Ga 2 O 3 is observed in both the cases of with & without field-plate. So, the future of HEMT technology is promising with the ongoing improvements to fulfil operational needs.
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