1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics

Co-packaged optics (CPO) has emerged as a promising solution to address the limitations of traditional pluggable optical transceivers, offering enhanced bandwidth, improved energy efficiency, and reduced signal loss. This paper presents a low-cost, volume-manufacturable Fan-Out Wafer Level Packaging (FOWLP) silicon photonic engine with an aggregate data transmission capacity of 1.79 Tbps (8 × 224 Gbps). The FOWLP platform enables the seamless integration of Electronic ICs (EICs) and Photonic ICs (PICs) without wire bonds, preserving signal integrity and minimizing losses. By demonstrating 112 Gbaud NRZ (112 Gbps/λ) and PAM4 (224 Gbps/λ) transmission with minimal digital signal processing, this work highlights the potential of silicon photonics for 200 Gbps/λ Co-Packaged Optics (CPO) and Linear Pluggable Optics (LPO) applications. The findings underscore the enhanced signal integrity, power efficiency, and reduced latency achieved with FOWLP, addressing critical bottlenecks in hyperscale data centers and AI/ML clusters.