Impact of temperature on electromigration lifetime extrapolation

The extrapolation of EM lifetimes obtained from high temperature tests to lower temperatures is investigated. It is shown that the usual extrapolation method leads to large errors for the predicted lifetimes at temperatures closer to the real operating conditions. A different approach for estimating the extrapolation parameters is discussed, where the results show significantly smaller errors. Thus, the reliability of interconnects regarding electromigration failures is more precisely assessed.