环氧树脂
热固性聚合物
固化(化学)
热重分析
热稳定性
材料科学
肟
差示扫描量热法
环境友好型
高分子化学
复合材料
有机化学
化学
物理
热力学
生态学
生物
作者
Hyunshick Youn,Younggi Hong,Ayeong Yu,Jisu Jeong,Munju Goh
摘要
Abstract Epoxy, a typical thermosetting resin, exhibits excellent mechanical properties, thermal stability, and chemical resistance. However, it can cause environmental pollution when discarded prior to decomposition. In this study, a novel oxime epoxy based on 1,4‐benzoquinone dioxime was developed. It decomposes quickly under mild conditions and without requiring organic solvents, thus is environmentally friendly. The optimal curing temperature for benzoquinone oxime epoxy (BOE) with a curing agent was 85°C as determined by differential scanning calorimetry. In addition, the tensile strength and Young's modulus of the BOE/1,6‐hexanediamine (HMDA) resin are 20 and 400 MPa, respectively, and T g is 76°C. Furthermore, thermogravimetric analysis revealed that the BOE resin was thermally stable. Interestingly, BOE/HMDA degraded in 8 h under mild conditions. This rapid degradation will facilitate the development of new chemically degradable epoxy molecules with embedded oximes and provide insights into solving the environmental problems caused by discarded epoxy resin.
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