UV ‐Curable Acrylic Pressure Sensitive Adhesive With Tailored Crosslinked Structure for Temporary Bonding Applications

ABSTRACT The demand for pressure‐sensitive adhesives (PSAs) has increased to ensure substrate protection and stability in display and semiconductor manufacturing processes. PSAs serve as critical protective films not only in organic light‐emitting diode displays but also throughout various semiconductor fabrication steps. While conventional semi‐interpenetrating polymer networks (semi‐IPN) utilize physical entanglement, they face significant challenges in adhesion control. Wetting ability decreases as crosslinking density increases, leading to unstable adhesion. Furthermore, linear polymer chains that are physically trapped rather than chemically bound can migrate to the interface, causing residue and “ghosting.” To overcome this, this study proposes a fully crosslinked structure. An acrylic prepolymer was synthesized using 2‐ethylhexyl acrylate, methyl methacrylate, acrylic acid, and N‐(isobutoxymethyl)acrylamide. A superior fully crosslinked structure was realized by incorporating glycidyl methacrylate and employing dipentaerythritol hexaacrylate as a high‐functionality crosslinker. This dual‐strategy chemical anchoring covalently locks all polymeric components into the network, achieving superior cleanliness without chain migration. To meet the increasing demand for temporary bonding/debonding adhesives in semiconductors and display fabrication, the developed PSA was designed to provide stable adhesion during processing and clean removal with minimal residue. This comprehensive approach effectively addresses key TBDB requirements, including peel strength control, cohesion, surface wettability, and residue minimization.