材料科学
光电子学
二极管
半导体
晶体管
基质(水族馆)
数码产品
原子单位
氧化物
纳米技术
电气工程
工程类
冶金
电压
地质学
物理
海洋学
量子力学
作者
Xing Wu,Chen Luo,Hao Peng,Tao Sun,Runsheng Wang,Chaolun Wang,Zhigao Hu,Yawei Li,Jian Zhang,G. Bersuker,Litao Sun,K. L. Pey
标识
DOI:10.1002/adma.201703025
摘要
The interface between III-V and metal-oxide-semiconductor materials plays a central role in the operation of high-speed electronic devices, such as transistors and light-emitting diodes. The high-speed property gives the light-emitting diodes a high response speed and low dark current, and they are widely used in communications, infrared remote sensing, optical detection, and other fields. The rational design of high-performance devices requires a detailed understanding of the electronic structure at this interface; however, this understanding remains a challenge, given the complex nature of surface interactions and the dynamic relationship between the morphology evolution and electronic structures. Herein, in situ transmission electron microscopy is used to probe and manipulate the structural and electrical properties of ZrO2 films on Al2 O3 and InGaAs substrate at the atomic scale. Interfacial defects resulting from the spillover of the oxygen-atom conduction-band wavefunctions are resolved. This study unearths the fundamental defect-driven interfacial electric structure of III-V semiconductor materials and paves the way to future high-speed and high-reliability devices.
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