蚀刻(微加工)                        
                
                                
                        
                            阳极                        
                
                                
                        
                            阴极                        
                
                                
                        
                            超级电容器                        
                
                                
                        
                            材料科学                        
                
                                
                        
                            电化学                        
                
                                
                        
                            化学工程                        
                
                                
                        
                            电极                        
                
                                
                        
                            电容                        
                
                                
                        
                            熔盐                        
                
                                
                        
                            氟                        
                
                                
                        
                            杂质                        
                
                                
                        
                            纳米技术                        
                
                                
                        
                            金属                        
                
                                
                        
                            表面改性                        
                
                                
                        
                            分析化学(期刊)                        
                
                                
                        
                            化学                        
                
                                
                        
                            冶金                        
                
                                
                        
                            物理化学                        
                
                                
                        
                            有机化学                        
                
                                
                        
                            图层(电子)                        
                
                                
                        
                            工程类                        
                
                        
                    
            作者
            
                Miao Shen,Weiyan Jiang,Kun Liang,Sufang Zhao,Rui Tang,Linjuan Zhang,Jian‐Qiang Wang            
         
                    
        
    
            
            标识
            
                                    DOI:10.1002/ange.202110640
                                    
                                
                                 
         
        
                
            摘要
            
            Abstract Surface terminations of two‐dimensional MXene (Ti 3 C 2 T x ) considerably impact its physicochemical properties. Commonly used etching methods usually introduce ‐F surface terminations or metallic impurities in MXene. We present a new molten‐salt‐assisted electrochemical etching method to synthesize fluorine‐free Ti 3 C 2 Cl 2 . Using electrons as reaction agents, cathode reduction and anode etching can be spatially isolated; thus, no metallics are present in the Ti 3 C 2 Cl 2 product. The surface terminations can be in situ modified from −Cl to −O and/or −S, which considerably shortens the modification steps and enriches the variety of surface terminations. The obtained −O‐terminated Ti 3 C 2 T x are excellent electrode materials for supercapacitors, exhibiting capacitances of 225 F g −1 at 1.0 Ag −1 , good rate performance (91.1 % at 10 Ag −1 ), and excellent capacitance retention (100 % after 10000 charge/discharge cycles at 10 Ag −1 ), which is superior to multi‐layered Ti 3 C 2 T x prepared by other etching methods.
         
            
 
                 
                
                    
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