绝缘栅双极晶体管
碳化硅
双极结晶体管
电气工程
功率半导体器件
工程物理
电力电子
晶体管
工程类
MOSFET
功率(物理)
电子工程
材料科学
电压
物理
量子力学
冶金
作者
Florin Udrea,Gerald Deboy,Tatsuhiko Fujihira
标识
DOI:10.1109/ted.2017.2658344
摘要
Superjunction has arguably been the most creative and important concept in the power device field since the introduction of the insulated gate bipolar transistor (IGBT) in the 1980s. It is the only concept known today that has challenged and ultimately proved wrong the well-known theoretical study on the limit of silicon in high-voltage devices. This paper deals with the history, device and process development, and the future prospects of Superjunction technologies. It covers fundamental physics, technological challenges as well as aspects of design and modeling of unipolar devices, such as CoolMOS. The superjunction concept is compared to other methods of enhancing the conductivity of power devices (from bipolar to employment of wide-bandgap materials) to derive its set of benefits and limitations. This paper closes with the application of the superjunction concept to other structures or materials, such as terminations, superjunction IGBTs, or silicon carbide Field Effect Transistors (FETs).
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