The Effect of a Hot–Wet Environment on Adhesively Bonded Joints Under a Sustained Load

The aim of this research was to develop numerical modelling techniques for simulating the simultaneous effects of moisture, elevated temperature, and applied load on the performance of adhesively bonded joints. Associated experimental data are also reported. The degradation process of the joints was modelled using a fully-coupled approach, with the moisture concentration affecting the stress distribution and the stress state affecting the moisture diffusion analyses simultaneously. Further, the stress analysis contains a moisture-dependent creep model to accommodate viscous effects, and both swelling and thermal strains were included in the simulation. The governing parameters adopted in the modelling procedure were determined from experimental work based on the bulk adhesive. The joint response was monitored throughout the ageing process and good correlation was found between the experimental and numerical results.