材料科学
退火(玻璃)
极限抗拉强度
压痕硬度
残余应力
合金
硬化(计算)
复合材料
微观结构
体积分数
再结晶(地质)
软化
冶金
位错
古生物学
生物
图层(电子)
作者
Jingzhao Yang,Kun Bu,Yanjun Zhou,Kexing Song,Yu Song,Tao Huang,Xiaowen Peng,Haitao Liu,Yibo Du
标识
DOI:10.1016/j.jallcom.2023.168705
摘要
The changes in the tensile strength, microhardness, electrical conductivity and residual stress of the C19400 alloy strips annealed at 100–500 ℃ for a short time were studied. The coordinated control mechanism of the high strength and low residual stress of the C19400 alloy strips by short-time annealing was revealed. The results show that annealing at 200 °C can maintain high strength and reduce the residual stress. When annealed at 200 °C, the tensile strength is only 0.6 % lower than that of the original state, while the residual stresses of transverse direction and rolling direction are 47.2 % and 90.9 % lower than that of the original state, respectively. Reducing the volume fraction of Brass, Copper and S textures is beneficial for controlling the residual stress of the C19400 alloy. Most remarkably, compared with the original state, after annealing at 300 ℃, the tensile strength and microhardness increase from 428 MPa to 432.5 MPa and 141.6 HV to 144.8 HV, respectively. When annealing at 400–500 ℃, the tensile strength and microhardness decrease significantly. The main influencing factor of annealing hardening and softening is dislocation density. In the former, dislocation blocking increases the dislocation density during low-temperature annealing, while in the latter, recovery and recrystallization occur, and the dislocation density decreases after high-temperature annealing. The results provide a reference for improving the performance of ultrathin C19400 alloy strips.
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