材料科学
复合材料
钛酸钡
电介质
聚乙烯醇
复合数
介电谱
纳米纤维
扫描电子显微镜
介电损耗
结晶度
动态力学分析
傅里叶变换红外光谱
介电常数
静电纺丝
高-κ电介质
拉曼光谱
钛酸酯
纳米片
电导率
石墨烯
氧化物
能量色散X射线光谱学
纤维
作者
Tashfin Akhtar,Hamza Ali,Muhammad Uzair,Nourreddine Sfina,M.D. Alshahrani,Salma Alshehri,Essam A. Al‐Ammar,Vineet Tirth,Ali Algahtani,Hamza Rekab-Djabri,Nasir Rahman
标识
DOI:10.1177/00219983251383157
摘要
Polyvinyl alcohol (PVA)-based nanofibers were reinforced with copper oxide (CuO) and barium titanate (BaTiO 3 , BT) to form ternary composite nanofibers via electrospinning, targeting improvements in dielectric and mechanical properties for potential microelectronic and energy-related applications. Composite solutions with 5, 10, and 15 wt.% of combined CuO-BT fillers were prepared and electrospun into nanofibers. Structural and morphological characterizations were carried out using X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FTIR), scanning electron microscopy (SEM), and energy-dispersive X-ray spectroscopy (EDX). XRD analysis confirmed the semi-crystalline nature of PVA, and a decrease in crystallinity of PVA with filler incorporation. SEM micrographs showed smooth, continuous fibers at lower filler content, while higher loadings induced agglomeration. Dielectric measurements performed using an LCR meter revealed that the 10 wt.% CuO-BT/PVA composite exhibited the highest dielectric constant (∼23.4), capacitance (148 pF), and AC conductivity (1.1 × 10 -7 S/m), while further increases in filler content led to a decline, indicating optimal composition. Dielectric losses (tan δ) increased with filler loading, suggesting trade-offs between conductivity and energy dissipation. Mechanical testing using a universal testing machine (UTM) showed a substantial increase in Young’s modulus from 0.24 GPa (pure PVA) to 6.67 GPa at 5 wt.%, followed by a reduction at higher filler contents due to filler agglomeration and interfacial defects. The optimized 10 wt.% composite nanofibers demonstrated enhanced performance, making CuO and BT co-doped PVA nanofibers promising candidates for dielectric layers in flexible electronics and capacitive components.
科研通智能强力驱动
Strongly Powered by AbleSci AI