Optimization of solder reflow processing and part design in thermoplastic optical interconnect components

Thermoplastic polyetherimides (ULTEM™ and EXTEM™ resins) have been used to produce complex optical lenses and ferrules that are integrated in optical interconnect sub-assemblies. Current thermoplastic optics must be added separately to prevent dimensional changes from the 260°C peak temperature of a solder reflow process. This paper covers injection molding parameters and solder reflow conditions that influence optical properties and dimensional stability of solder-reflowable test components.