Thermal Management Verification Platform for Chiplet Functional Unit

Advanced packaging technologies like 2. 5 D3 D integration introduce critical thermal challenges in chipletbased systems, including hotspots and thermomechanical stress. This work presents a reconfigurable thermal test vehicle (TTV) with programmable microheaters and embedded sensors to emulate dynamic power maps and enable in-situ thermal monitoring. Integrated with a manifold-microchannel cold plate (MMCP), the platform achieves junction-to-coolant thermal resistance below 1.8 K/W and temperature uniformity within 3° C under 94 W power. This hardware-validated approach bridges the simulation-to-silicon gap, supporting thermal optimization for heterogeneous integration.