聚酰亚胺
共聚物
材料科学
电容器
电介质
单体
高分子化学
聚合
极化率
复合材料
化学工程
聚合物
电压
光电子学
有机化学
化学
电气工程
分子
工程类
图层(电子)
作者
Huijian Ye,Lianlian Chen,Huilei Jiang,Lixin Xu
标识
DOI:10.1021/acsapm.3c02639
摘要
Dielectric film capacitors have received extensive attention because of their fast release rate and great electrical reliability. A polymer film with large energy density and charge–discharge efficiency is required to expand the application of film capacitors at high temperatures. In this work, a series of ternary fluorinated polyimides (FPI) with different fluorine-containing ratios have been copolymerized to investigate the high-temperature electrical displacements. The fluoro-dianhydride monomer was introduced into the regular 4,4′-diaminodiphenyl ether polymerization system with accompanied thermal imidization. The FPI film exhibits large energy capability with intrinsic breakdown strength compared with pristine PI, which is ascribed to the strong electronegative effect and hydrophobic feature of –CF3 as well as the increase of free volume in bulk. The energy density of optimal FPI film reaches 20.2 J/cm3 at 659 MV/m, and the high-temperature energy storage property is improved, e.g., the energy density up to 11.5 J/cm3 with an external field of 525 MV/m at 100 °C. Low molar polarizability between C–F bonds also contributes to the decreased leakage current, which results in the large charge–discharge efficiency under high temperatures. The PI film with tailored fluorostructure demonstrates the competing candidate for the application of a high-temperature polymer film capacitor.
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