Lightweight Polyimide Foam-Derived Carbon Foam with Anisotropic Porous Structure for Efficient Hydrophobicity and High-Temperature Thermal Insulation at 1000 °C

材料科学 保温 复合材料 聚酰亚胺 碳纳米泡沫 多孔性 气凝胶 金属泡沫 热的 各向异性 多孔介质 石墨烯泡沫 纳米技术 图层(电子) 石墨烯 气象学 物理 氧化石墨烯纸 量子力学
作者
Long Ni,Xiaoting Liao,Ke‐Ke Yang,Hang Ye,Hexing Sun,Yinfu Luo,Liwei Yan,Shuang Xia,Mei Liang,Shengtai Zhou,Huawei Zou
出处
期刊:ACS Applied Materials & Interfaces [American Chemical Society]
卷期号:17 (36): 51303-51314 被引量:1
标识
DOI:10.1021/acsami.5c13960
摘要

In this work, the fabrication of lightweight, hydrophobic, and high-temperature thermal insulative polyimide foam-derived carbon foams (PICFs) with an anisotropic pore structure was proposed. First, polyester ammonium salt (PEAS) precursor powders with different component moieties were synthesized by a copolymerization method. Then, the PEAS powders were subjected to microwave-assisted foaming, thermal imidization, and carbonization processes to prepare PICFs. The "bottom-up" directional foaming behavior and high carbon yield of polyimide foams (PIFs) constructed regular honeycomb-like pores in the vertical direction and aligned ellipsoidal strip-like pores in the horizontal direction of the PICFs. Results showed that the PICFs possessed low density (20-40 kg/m3), small pore size (128 μm), favorable mechanical properties (compressive strength of 86.01 kPa) and excellent thermal stability (T5% > 800 °C). By combining micro/nano porous structures with reduced pore diameters, the PICFs exhibited excellent hydrophobicity, with a water contact angle of up to 128.8° in the vertical direction and 121.2° in the horizontal direction. The PICFs demonstrated superior thermal insulation properties at both room temperature and high temperatures, with thermal conductivity values ranging from 0.0335 to 0.1887 W/(m·K) between 25 and 1000 °C. Thus, lightweight, hydrophobic, and high-temperature thermal insulative PICFs were successfully prepared using the proposed method, which has potential applications in high-end engineering fields such as aerospace, transportation, microelectronics, and nuclear energy sectors, among others.
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