节点(物理)
缩放比例
晶体管
光电子学
材料科学
MOSFET
计算机科学
电气工程
物理
工程类
电压
数学
几何学
量子力学
作者
Weisheng Li,Ming Du,Chunsong Zhao,Guangkai Xiong,Weizhuo Gan,Lei Liu,Taotao Li,Yuan Gao,Fuchen Hou,Junhao Lin,Dongxu Fan,Hao Qiu,Zhihao Yu,Jeffrey Xu,Yijun Shi,Xinran Wang
标识
DOI:10.1109/iedm50854.2024.10873379
摘要
We report on the first monolayer MoS2 FETs scaled to 40 nm contacted gate pitch (CGP), corresponding to 1 nm node as defined by IRDS. The FETs deliver drive current of 0.79 $\text{mA}/\mu \mathrm{m}$ under 0.6 V drain bias with on/off ratio $> 10^{7}$ and SS = 62 mV/dec. We achieve this by developing a new Sb deposition technology which reduces $R_{\mathrm{c}}$ to below 100 $\Omega\cdot\mu \mathrm{m}$ at deep $L_{\mathrm{c}}$ scaling regime $(L_{\mathrm{c}}=20\ \text{nm})$. TCAD simulations predict that quad-stacked Mos2 nanosheet FET employing the new Sb contact reduces the gate delay by 46.6% compared to Si CMOS at 1 nm node and demonstrates superior scaling potential to the end of roadmap.
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