Solution Deposition Planarization as an Alternative to Electro-Mechanical Polishing for HTS Coated-Conducters

Mechanically flexible substrates are increasingly utilized in electronics and advanced energy technologies like solar cells and high-temperature superconducting coated conductors (HTS-CCs). These substrates offer advantages, such as large surface areas and reduced manufacturing costs through reel-to-reel processing, but often lack the surface smoothness needed for optimal performance. For HTS-CCs, specific orientation and high crystalline quality are essential, requiring buffer layers to prepare the amorphous substrate for superconductor deposition. Techniques, such as mechanical polishing, electropolishing, and chemical-mechanical polishing, can help achieve an optimally levelled surface suitable for the subsequent steps of sputtering and ion-beam-assisted deposition (IBAD) necessary for texturing. This review examines Solution Deposition Planarization (SDP) as a cost-effective alternative to traditional electro-mechanical polishing for HTS coated conductors. SDP achieves surface roughness levels below 1 nm through multiple oxide layer coatings, offering reduced production costs. Comparative studies demonstrate planarization efficiencies of up to 20%. Ongoing research aims to enhance SDP’s efficiency for industrial applications in CC production.