PCB Layout Design and Optimization of a High-Performance Power Module with Paralleled Top-Side-Cooling Packaged MOSFETs

Top-Side-Cooling (TSC) packaged MOSFETs offer significant advantages in power density, simplified integration, and thermal management. However, their application in high-power converters (>5kW), such as residential energy storage systems or EV on-board chargers, requires paralleling multiple devices. This poses critical design challenges in achieving symmetrical current distribution, minimizing power and gate loop parasitics, and ensuring effective thermal spreading. To address these issues, this paper proposes a systematic PCB layout design and optimization methodology specifically for paralleled TSC packages. The methodology covers power loop optimization, gate driver layout, and detailed thermal analysis. A comprehensive performance comparison between different layout strategies is presented. Finally, the effectiveness of the proposed methodology is demonstrated with a prototype of an isolated single-stage bidirectional AC-DC converter that employs the optimal design, achieving a state-of-the-art power density of 75 W/in³.