Reliability Prediction and Improvement of Board-Level Thermal Cycling Test for Molded Flip-Chip Ball-Grid-Array Package

The study focused on the Board-Level Thermal Cycling Test (BL-TCT) reliability of the Molded Flip-Chip Ball-Grid-Array (MFCBGA) package. The Anand viscoplastic model was used to describe the plastic and creep behaviors of the solder material. The lifecycle prediction model with Morrow's energy based method was used to fit a number of data points and the deviation of characteristic lifecycle can be predicted within ±15%. Furthermore, the parametric studies were conducted to enhance the lifecycle of MFCBGA series.