Strength analysis of solder joints used in microelectronics packaging

The aim of the research was the problem of damage accumulation for solder alloys used in microelectronics packaging due to creep and fatigue as a result of a combined profile of loading conditions. The selected failure modes affect the lifetime of contemporary electronic equipment. So far the research activities are focused on a single failure mode and the problem of their interaction is often omitted. Taking into account the failure modes interaction would allow more precise lifetime prediction of the contemporary electronic equipment and/or would allow for reduction of time required for reliability tests. Within the taken research framework the reliability analysis of solder joints was conducted for the Sn63Pb37 solder alloy using the Hot Bump Pull method. The results of the presented research contain: reliability tests, statistical analysis and the problem of a damage accumulation due to a combined profile of loading conditions.