材料科学
退火(玻璃)
空位缺陷
外延
大气温度范围
化学气相沉积
热力学平衡
薄脆饼
晶体缺陷
消灭
扩散
分析化学(期刊)
热力学
结晶学
纳米技术
冶金
化学
核物理学
物理
色谱法
图层(电子)
作者
Hussein M. Ayedh,Viktor Bobal,Roberta Nipoti,Anders Hallén,B. G. Svensson
标识
DOI:10.4028/www.scientific.net/msf.858.331
摘要
The carbon vacancy (V C ) is a major point defect in high-purity 4H-SiC epitaxial layers limiting the minority charge carrier lifetime. In layers grown by chemical vapor deposition techniques, the V C concentration is typically in the range of 10 12 cm -3 and after device processing at temperatures approaching 2000 °C, it can be enhanced by several orders of magnitude. In the present contribution, we show that the cooling rate after high-temperature processing has a profound influence on the resulting V C concentration where a slow rate promotes elimination of V C . Further, isochronal annealing of as-grown and as-oxidized epi-layers protected by a carbon-cap was undertaken between 800 °C and 1600 °C. The results reveal that thermodynamic equilibrium of V C is established rather rapidly at moderate temperatures, reaching a V C concentration of only a few times 10 11 cm -3 after 40 min at 1500 °C. Hence, the concept of eliminating V C ’s by annealing at moderate temperatures under C-rich equilibrium conditions shows great promise and enables re-annealing of high-temperature processed wafers, in contrast to the procedures commonly used today to eliminate V C . In-diffusion of carbon interstitials and out-diffusion of V C ’s are discussed as the kinetics processes establishing the thermodynamic equilibrium
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