High-Thermal-Conductivity Flexible Boron Nitride Composite Films Enabled by the Directional Arrangement of Nanosheet Assemblies

) directions. Using it as TIMs for LED chips, the device temperature can be significantly reduced by 15 °C. In addition to the excellent flame-retardant properties and wave transmission, the composite film exhibits extreme stability after thermal and cold shock cycles. This work provides a rational design for the thermal management of high-power-density electronic devices.