材料科学
聚酰亚胺
帕利烯
柔性电子器件
保形涂层
光电子学
弯曲半径
基质(水族馆)
图层(电子)
卷到卷处理
纳米技术
弹性体
氧化物
降级(电信)
复合材料
单层
封装(网络)
有机电子学
原子层沉积
数码产品
锌
灵活的显示器
响应时间
聚合物
聚二甲基硅氧烷
光电探测器
光伏
涂层
作者
Shinyoung Lee,Lulu Sun,Sung‐Hoon Lee,Kenjiro Fukuda,Takao Someya
标识
DOI:10.1021/acsami.5c20639
摘要
Ultraflexible organic photovoltaics (OPVs) are promising candidates for next-generation wearable and portable electronics due to their lightweight, flexibility, and conformal properties. However, their long-term operational stability remains a critical challenge, as they are susceptible to degradation from both photo- and mechanical stress. The degradation pathways are further worsened by UV radiation, which degrades the active materials, as well as the device's interfacial and encapsulation layers. We addressed this by fabricating a 3.6 μm-thick polyimide (PI) film that functions as both a flexible substrate and a UV filter with a cutoff wavelength about 380 nm. When encapsulated with parylene, the ultraflexible devices demonstrated exceptional mechanical durability, enduring 4000 cyclic bends at a 0.5 mm radius without performance loss. Under 1-Sun ambient irradiation, the PI film's UV-filtering effect proved to be crucial. It not only prevented internal oxygen generation from the zinc oxide layer but also protected the parylene encapsulation from UV-induced degradation. This dual protection resulted in a T80 lifetime of 160 h for bent devices and approximately 220 h for unbent devices, with performance degradation primarily limited by the top parylene layer.
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