材料科学
热电材料
热电效应
铋
声子
热导率
微观结构
凝聚态物理
热膨胀
声子散射
熔点
塞贝克系数
固溶体
位错
散射
退火(玻璃)
热的
晶体缺陷
温度梯度
格子(音乐)
内应力
熔化温度
电阻率和电导率
复合材料
纳米技术
光电子学
热力学
作者
Tu Lyu,Moran Wang,Keer Lin,Qizhu Li,Yitao Lu,Hua‐Lu Zhuang,Hangtian Zhu,Pengfei Nan,Binghui Ge,Feng Rao,Lipeng Hu
摘要
ABSTRACT Engineered nanoprecipitates and dislocation networks are highly effective in suppressing lattice thermal conductivity, especially for thermoelectric materials with intrinsically short phonon mean free path. However, their concurrent integration remains largely elusive. Herein, we propose an atypically solidifying metal strategy to simultaneously engineer abundant nanoprecipitates and dislocation networks in Bi 0.35 Sb 1.65 Te 3 . Specifically, Ga is selected owing to its limited solubility, which facilitates the formation of uniformly dispersed nanoprecipitates. Upon solidification, these nanoprecipitates undergo anomalous volumetric expansion against the thermal contraction of the surrounding matrix, generating substantial internal stress that triggers the formation of extensive dislocation networks. Notably, these nanoprecipitates also exhibit an anomalously elevated melting point relative to bulk Ga, reinforcing microstructural robustness. Together with the resulting Ga‐Bi 0.35 Sb 1.65 Te 3 heterointerfaces further intensifies phonon scattering and enables carrier energy filtering, simultaneously suppressing lattice thermal conductivity and improving the power factor. Consequently, a state‐of‐the‐art zT of 1.53 at 375 K is achieved in p‐type Bi 0.35 Sb 1.63 Ga 0.02 Te 3 , delivering a power generation efficiency of 7.0% under a temperature gradient of 230 K, along with a maximum cooling temperature difference of 69.0 K at a hot‐side temperature of 303 K. These results establish atypically solidifying metals as a powerful and generalizable microstructure design paradigm for high‐performance thermoelectric materials.
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