Electrochemical Redox In-Situ Welding of Silver Nanowire Films with High Transparency and Conductivity

材料科学 薄板电阻 光电子学 纳米线 电导率 电极 接触电阻 纳米技术 图层(电子) 化学 物理化学
作者
Wang Zhang,Jiashuan Bao,Chenhui Xu,Pengfeng Zhu,Xiangliang Pan,Rui Li
出处
期刊:Inorganics (Basel) [Multidisciplinary Digital Publishing Institute]
卷期号:10 (7): 92-92 被引量:2
标识
DOI:10.3390/inorganics10070092
摘要

Silver nanowire (AgNW) networks with high transparency and conductivity are crucial to developing transparent conductive films (TCFs) for flexible optoelectronic devices. However, AgNW-based TCFs still suffer from the high contact resistance of AgNW junctions with both the in-plane and out-of-plane charge transport barrier. Herein, we report a rapid and green electrochemical redox strategy to in-situ weld AgNW networks for the enhanced conductivity and mechanical durability of TCFs with constant transparency. The welded TCFs show a marked decrease of the sheet resistance (reduced to 45.5% of initial values on average) with high transmittance of 97.02% at 550 nm (deducting the background of substrates). The electrochemical welding treatment enables the removal of the residual polyvinylpyrrolidone layer and the in-situ formation of Ag solder in the oxidation and reduction processes, respectively. Furthermore, local conductivity studies confirm the improvement of both the in-plane and the out-of-plane charge transport by conductive atomic force microscopy. This proposed electrochemical redox method provides new insights on the welding of AgNW-based TCFs with high transparency and low resistance for the development of next-generation flexible optoelectronic devices. Furthermore, such conductive films based on the interconnected AgNW networks can be acted as an ideal supporter to construct heterogeneous structures with other functional materials for wide applications in photocatalysis and electrocatalysis.
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