The near-surface microstructural evolution and the influence of Si particles during nanoscratching of nanocrystalline Al

Molecular dynamics (MD) simulations are performed to study the near-surface deformation during nanoscratching on nanocrystalline Al. The influence of Si particle on wear behavior of nanocrystalline Al is also investigated by MD simulation. It is shown that the local deformation in nanocrystalline Al workpiece is associated with one or more mechanisms: (1) grain boundary (GB) migration, (2) GB sliding, (3) grain rotation, and (4) dislocations and deformation twin emitting from the indenter-workpiece interface and GBs. Moreover, the coarsening of Al grains is observed as the scratch proceeds. During grain coarsening, the low angle GB dissociates while the high angle GB migrates without dissociation. Interestingly, the GB motion is more active in nanocrystalline Al workpiece than that in Al/Si workpiece. The presence of Si particle changes the stress state of the adjacent Al grains, and therefore enhances the stability of GBs. Meanwhile, the specific wear rate in Al/Si workpiece is significant less than that in nanocrystalline Al workpiece, indicating that the Si particle enhances the wear resistance. In summary, this study sheds light on the interaction mechanism of second-phase and nanocrystalline matrix under sliding wear, which can provide theoretical support for the design of metal matrix composite with excellent wear resistance.