Microelectronic System Reliability Prediction

The paper reviews the US MIL-HDBK-217 (MH-217) method of part stress-analysis failure-rate prediction for microelectronic systems and investigates the extent to which the MH-217 failure-rate formula is compatible with the physics of actual failure modes. A new formula is proposed which takes account separately of the reliability of the microelectronic devices in a system and of the system-level determinants of reliability. It is simpler than the current MH-217 formula, and more useful. It enables the system level aspects such as reliability program activities to be taken into account in the prediction, and allows better correlation to be made between part test and system test data. An example applies the new formula to a typical microelectronic system. By considering separately the failure physics of parts and the system level determinants, reliability prediction can be made a more useful tool both for part stress analysis and for reliability program management. The model would enable better correlations to be made between part and system test results. More work needs to be done to refine and validate the parameters. For high-reliability programs with closely controlled maintenance or with no maintenance, the use of a decreasing failure rate model for part failures should be considered. The failure rate formulae for other electronic parts used in microelectronic systems would also need to be reviewed, but apart from removal of the environmental factor and reduction in the failure rate values proportionate to that proposed for microelectronic parts, no changes should be necessary.