Research Status and Prospect of CD/Cu Composite for Electronic Packaging Material

With the rapid development of electronic information technology,electronic instrument is devel- oped miniaturization,portable,multi-functionalization,and traditional electronic packaging material can not meet the need of modern integrated circuit package.Diamond/Cu( CD/Cu) composite as new elec- tronic packaging material has the characteristics of high thermal conductivity,controllable thermal expan- sion coefficient,lower density,etc.In recent years,it becomes hotspot of research.This article outlines the preparation technology and excellent performance of the CD/Cu composite for electronic packaging.And the development of CD/Cu composite for electronic packaging is also reviewed.