Abstract Glass frit seal with localized heating using near infrared laser can provide long‐term hermeticity and good mechanical strength for OLEDs. In this report, some general characteristics of the frit sealing process are first discussed. Then the impacts offrit and glass substrate properties, such as CTE and strain points on the seal, will be presented. It is found that CTE of the frit may not match with that of glass substrates used for lighting application. The optimal CTE values of glass substrate for OLED lighting and frit are presented.