The Analysis of Wettability and Mechanics of Polyimide Film With Atmospheric Pressure Plasma Treatment

ABSTRACT Polyimide (PI) films are widely utilized in electronic and aerospace applications due to their exceptional thermal stability, mechanical strength, chemical and radiation resistance, and dielectric properties. However, their poor surface wettability, adhesion, and printability significantly limit their industrial applicability. This study employs atmospheric pressure air plasma to modify the surface of PI films, aiming to enhance their etchability and wettability while investigating the mechanical properties under various treatment conditions. The physical alterations induced by plasma treatment are thoroughly analyzed. Results indicate that plasma treatment increases the concentration of oxygen‐containing functional groups on the PI surface, introducing new OCO groups, which elevate surface free energy and improve wettability. As the treatment speed decreases, surface etching intensifies, leading to increased roughness. Tensile strength tests and a three‐dimensional dynamic optical strain testing system were employed to assess the impact of plasma modification on mechanical properties, revealing the stress–strain evolution mechanisms of PI films before and after treatment. This work provides insights into optimizing plasma treatment parameters for improved PI film performance.