串扰
光子学
光子集成电路
移相模块
电子线路
沟槽
谐振器
热的
集成电路
硅光子学
光电子学
散热片
材料科学
光学
电子工程
物理
电气工程
工程类
插入损耗
纳米技术
气象学
图层(电子)
作者
Souvaraj De,Ranjan Das,Ravi K. Varshney,Thomas Schneider
出处
期刊:IEEE Access
[Institute of Electrical and Electronics Engineers]
日期:2020-01-01
卷期号:8: 141632-141640
被引量:42
标识
DOI:10.1109/access.2020.3013116
摘要
We investigate and demonstrate the thermal crosstalk problem in integrated photonic circuits with metal and silicon doped heaters. Further, we illustrate that due to the localized heating effect, integrated doped heaters are out-performed in terms of thermal crosstalk as compared to integrated metal heaters. To mitigate thermal crosstalk and enhance phase tuning efficiency further, a CMOS compatible air-filled trench region is realized between the doped heater and the adjacent element. The performances of three fundamental building blocks of integrated photonic circuits, namely, a PN phase shifter, an optical attenuator, and a ring resonator, are tested by full-wave thermal, charge, and optical simulations. Additionally, the impact of thermal crosstalk on the performance of integrated PN phase shifters and optical attenuators is examined thoroughly. The proposed low crosstalk thermal phase shifters might be very beneficial for densely routed complex integrated photonic circuits like photonic transceivers for data centers, optical phased array antennas, and photonic reservoirs.
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