材料科学
热稳定性
复合数
复合材料
氮化硼
热导率
极限抗拉强度
热分解
分散性
化学工程
色散(光学)
纤维素
勃姆石
高分子化学
有机化学
化学
物理
光学
工程类
铝
作者
Xiu Wang,Mengya Sun,Ruibin Wang,Liang Jiao,Huiyang Bian,Hongqi Dai
标识
DOI:10.1016/j.matdes.2021.110379
摘要
Hexagonal boron nitride (h-BN) is an excellent thermally conductive and electrically insulative material. However, the formation of heat transfer pathways of h-BN in thermal interface materials is restricted due to its poor aqueous dispersity. Herein, water-soluble lignosulfonate (LS) is used to promote the dispersion of h-BN, the phenolic hydroxyl and three-dimensional structure of LS could form hydrogen bonding or steric hindrance with h-BN under ultrasound treatment. After mixing with cellulose nanofiber (CNF), the three-dimensional thermally conductive pathways are built in LS-BN/CNF aerogel through freeze-drying. The results show that the through-plane thermal conductivity of LS-BN/CNF/PVA composite with 0.2 wt% LS (LS0.2-BN/CNF/PVA) exceeds 1.22 W/mK when the h-BN/CNF ratio is 3:1 (w/w), which is 6.1-fold of that of PVA film (0.20 W/mK). The initial decomposition temperature and tensile strength of LS0.2-BN/CNF/PVA composite are 205 °C and 38.5 MPa, respectively, demonstrating acceptable thermal stability and mechanical properties for electronics as thermal interface and packing material. Overall, this work put forwards an effective approach to disperse h-BN and paves the way in developing high-performance thermal interface materials.
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