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On the cogent formulation of an elastomeric silicone ink material for direct ink write (DIW) 3D printing

材料科学 墨水池 硅酮 流变学 弹性体 胶粘剂 3D打印 复合材料 印象 收缩率 原材料 热固性聚合物 纳米技术 计算机科学 化学 有机化学 图层(电子) 万维网
作者
G. M. Fazley Elahee,Xiang Cheng,Lihan Rong,Mingwei Xu,Lucio Souza,Rigoberto C. Advíncula,João M. Maia
出处
期刊:Polymer Engineering and Science [Wiley]
卷期号:64 (6): 2476-2490 被引量:5
标识
DOI:10.1002/pen.26703
摘要

Abstract Adhesives and sealants show fine rheology with good physical and mechanical properties as viscous pastes, a possible starting point for developing direct ink writing (DIW) 3D printing ink. However, many commercial adhesives and sealants take days or weeks to cure fully. DIW 3D‐printed parts made directly from these sealants are not designed for a scalable manufacturing process and high‐volume production. Moreover, most of these adhesives and sealants have volume shrinkage during cure. A systematic understanding of formulation methods and design principles for an elastomeric silicone DIW ink can overcome these issues. This study presents the cogent formulation development of a 3D printable thermoset elastomer silicone that gels and cures isotropically in minutes, reducing cycle time for rapid ink development with no shrinkage during cure. More specifically, we outline the principles of raw material selection of a formulation to achieve excellent rheology, printability, synchronized working, and gel time fitting requirements closer to scalable manufacturing. The reaction kinetics and their corresponding 3D‐printed structural properties are also described. Interest in future work is toward a rational DIW 3D printing ink material development protocol and use of machine learning (ML). Highlights Formulation method flexibility and design principle of DIW ink. Raw material selection principle to achieve optimal rheology for DIW printing. Ink gel kinetics for large‐scale DIW manufacturing. Hydrosilylation conversion over time at different ambient temperatures. Structural properties of DIW 3D printed parts.

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