材料科学
电阻率和电导率
半导体
宽禁带半导体
光电子学
压电
可靠性(半导体)
带隙
电子迁移率
凝聚态物理
功率(物理)
复合材料
电气工程
热力学
物理
工程类
作者
YanPeng Qiao,MingHao Zhao,GuoShuai Qin,Chunsheng Lu,CuiYing Fan
出处
期刊:AIP Advances
[American Institute of Physics]
日期:2023-01-01
卷期号:13 (1)
被引量:4
摘要
GaN is an excellent material choice for power devices due to its excellent properties such as super wide bandgap width and high electron mobility. However, the problem of temperature affects the thermo reliability and hinders the potential of GaN devices. In this paper, the electrical properties of GaN under temperature have been studied by the combination of numerical simulation and experimental research. The electric current change and electrical resistivity of polarized and depolarized GaN semiconductor samples were tested in an environment-test cabinet. Based on the influence of temperature, the expression of the resistivity curve vs temperature was established for polarized and depolarized GaN samples. It is shown that the resistivity model predictions are consistent with experimental results. The I–V characteristic curves under different temperatures were also measured. Thus, such a model is instructive to the reliable design of GaN high-temperature devices. The findings will be instructive to the optimal design of GaN electronic components.
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