The adhesive with heat resistance is widely utilized in many fields, such as in aerospace、auto industry and the electronics, one of which is the epoxy adhesive, which is often used as the matrix of the adhesive with heat resistance, for its cheap cost、high adhesive strength and excellent comprehensive performance. However, the thermo stability of the cured epoxy adhesive isn't so high, which restricts the application of the epoxy adhesive. Therefore, the domestic and foreign research development of preparing epoxy adhesive with high-temperature resistance, which is modified by inorganic filler、thermoplastic、rubber and so on, is reviewed. The trend of the epoxy adhesive with high-temperature resistance in the future is prospected at last.