散射
薄脆饼
物理
双向反射分布函数
光散射
散射理论
米氏散射
材料科学
计算物理学
极化(电化学)
粒子(生态学)
领域(数学)
光学
光电子学
反射率
化学
数学
纯数学
海洋学
物理化学
地质学
作者
Cheng Liao,Shuang Xu,Zhenyuan Xia,Ruyi Ma
出处
期刊:Eleventh International Conference on Information Optics and Photonics (CIOP 2019)
日期:2019-12-20
卷期号:: 223-223
被引量:1
摘要
Wafer surface defect detection plays an important role in product yield improvement. Particles are the main source in the majority of defects on wafer. We calculate and analyze the scattering field around the particles on the un-patterned wafer surface by light scattering method. A model was built to calculate an isolated particle based on Mie theory firstly, and another model was built to calculate particle scattering field on a smooth wafer surface based on Bidirectional Reflectance Distribution Function (BRDF). We simulated the scattering field with different parameters set: incidence angle, polarization state and scattering angle channel. The results verify the feasibility of our method to calculate the scattering field.
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