On the deposition rate in a high power pulsed magnetron sputtering discharge

The effect of the high pulse current and the duty cycle on the deposition rate in high power pulsed magnetron sputtering (HPPMS) is investigated. Using a Cr target and the same average target current, deposition rates are compared to dc magnetron sputtering (dcMS) rates. It is found that for a peak target current density ITpd of up to 570mAcm−2, HPPMS and dcMS deposition rates are equal. For ITpd>570mAcm−2, optical emission spectroscopy shows a pronounced increase of the Cr+∕Cr0 signal ratio. In addition, a loss of deposition rate, which is attributed to self-sputtering, is observed.