Hardness testing of lead-free solders: a review

Purpose This paper aims to cover the recent (2010-2016) techniques for carrying out hardness evaluation on lead-free solders. Details testing configuration/design were compiled and discussed accordingly to each of the measurement techniques: Vickers microhardness, Brinell microhardness and nanoindentation. Design/methodology/approach A brief introduction on lead-free solders and the concept of hardness testing has been described at the beginning of the review. Equipment setup, capabilities, test configuration and outcomes were presented for each technique and discussed in parallel along with the case studies from selected articles. Findings Comparison, outcomes and insight regarding each of the methods were highlighted to observe the recent trends, scientific challenges, limitations and probable breakthroughs of the particular hardness testing methods. Originality/value The compilation of latest reports, technical setup plus with the critics and perception from the authors are the main key value in this review. This provides an in-depth understanding and guidance for conducting hardness evaluation on lead-free solders.