Review of Advancements and Future Directions in the Fabrication of Microchannel Heat Sinks for Electronic Cooling

Abstract: With the increasing demand for enhanced thermal performance and energy efficiency, microchannel heat sinks (MCHSs) have garnered significant attention as an effective method for dissipating the heat flux from thermal systems. Microchannel heat sinks have widespread applications in electronic devices, offering superior heat removal rates and ensuring optimal performance and durability. The fabrication of microchannels has been a long-standing challenge that has spurred continuous research efforts. Innovative techniques have emerged to address this challenge, leading to ongoing research aimed at the development of more efficient and contemporary cooling methods. This review comprehensively explores various microchannel fabrication techniques including photolithography, wire EDM, ultrasonic microfabrication, and etching. In addition, it provides insights into the selection of appropriate substrate materials. Extensive literature surveys have been conducted to compile a wealth of knowledge regarding these fabrication techniques. Furthermore, a detailed discussion is presented on the advantages and disadvantages of these fabrication methods, considering factors such as time efficiency, cost analysis, surface finish, product quality, and practical applications. While the review covers a broad spectrum of microchannel fabrication techniques, it places particular emphasis on the emerging 3D printing technology for microchannel fabrication, recognizing its potential to revolutionize the field.