Lv11
60 积分 2023-06-26 加入
Deep and Vertical Polyimide Etching
5小时前
待确认
Effect of NH3 flow rate to titanium nitride as etch hard mask in thermal atomic layer deposition
3个月前
已完结
A Segmented Plasma Etching Method for 2.5D/3D Through Silicon Vias
4个月前
已完结
Enhanced etch process for TSV & deep silicon etch
4个月前
已完结
Critical Challenges with Copper Hybrid Bonding for Chip-to-Wafer Memory Stacking
5个月前
已关闭
Fine Pitch Micro Indium Bump Interconnect Flip Chip Bonding
5个月前
已完结
A Study on SADP Film Stack Selection for Line Roughness Improvement in Planar 1Xnm NAND Flash
5个月前
已完结
A novel plasma etching technology of RIE-lag free TSV and dicing processes for 3D chiplets interconnect
5个月前
已完结
Formation mechanism of subtrenches on cone-shaped patterned sapphire substrate
6个月前
已完结
Vertical silicon nanowedge formation by repetitive dry and wet anisotropic etching combined with 3D self-aligned sidewall nanopatterning
6个月前
已完结
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