Lv5
968 积分 2026-03-23 加入
Principles of Plasma Discharges and Materials Processing
13小时前
已完结
Effects of process parameters and chamber structure on plasma uniformity in a large-area capacitively coupled discharge
17小时前
已完结
A Review of Recombination Coefficients of Neutral Oxygen Atoms for Various Materials
1天前
已完结
The critical role of electron induced secondary electrons in high-voltage and low-pressure capacitively coupled oxygen plasmas
1天前
已关闭
Benchmarking and validation of a hybrid model for electropositive and electronegative capacitively coupled plasmas
1天前
已完结
Investigation on charged particles in inductively coupled Ar/O2 plasmas: The role of Ar proportion
1天前
已完结
Factor Design for the Oxide Etching Process to Reduce Edge Particle Contamination in Capacitively Coupled Plasma Etching Equipment
1天前
已关闭
Ar/SF 6 plasma simulation for dual-frequency capacitively coupled plasma incorporating gas flow simulation and secondary electron emission
1天前
已完结
Plasma simulation for dual-frequency capacitively coupled plasma incorporating gas flow simulation
1天前
已完结
A study on etching properties of 6061 Al alloy by dual-frequency (60 MHz/400 kHz) capacitively coupled Ar, Ar/O 2 , NF 3 /Ar and NF 3 /Ar/O 2 plasma
1天前
已完结
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