Lv2
180 积分 2024-09-06 加入
Backside Chipping Investigation & Improvement on TiNiVAg Back Metal Silicon Die
4天前
已完结
Analysis and Modeling of Controlled Silicon Substrate Roughness for Silver-Based Backside Metallization in Power Electronics Packaging
4天前
已完结
High Performance Split-Gate-Trench MOS Based on Radiation-Hardening Technology and Its Total-Ionizing-Dose Radiation Effects
8天前
已完结
A Novel SGT MOSFET Based on Radiation-Hardening Technology and Its Total-Ionizing-Dose Radiation Effects
8天前
已完结
Study on The Degradations Produced by Different P-base Diffusion Temperatures on SGT MOSFET With Approximate Threshold Voltage
1个月前
已完结
(Invited) Trench-Gated MOSFET Instability Caused by High Temperature Reverse-Bias Stress
1个月前
已关闭
Research on Failure Mechanism of High Temperature Reverse Bias Test for Power VDMOS
1个月前
已关闭
HTRB-Based Assessment of Epoxy Mold Compounds Using a Multi-DUT Monitoring Platform
1个月前
已关闭
Hydrogen Proton Induced HTRB Reliability Degradation in Trench Power Devices
1个月前
已完结
Failure Analysis and Research on Shielded-Gate Trench MOSFET
1个月前
已完结
皖公网安备34019202002308
