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52 积分 2024-09-10 加入
Capacitance Degradation of SiC MOSFETs Under Dynamic Reverse Bias Stress: Displacement Current-Induced Charge Injection and JFET Design Optimization
1个月前
已完结
Degradation mechanism analysis for SiC power MOSFETs under repetitive power cycling stress
2个月前
已完结
Excimer laser planarization of AlSi, AlSiTi and AlSiCu alloys
4个月前
已完结
Study of Cu diffusion in an Al–1wt.%Si–0.5wt.%Cu bond pad with an Al–1wt.%Si bond wire attached using scanning electron microscopy
4个月前
已完结
Degradation mechanism analysis for SiC power MOSFETs under repetitive power cycling stress
5个月前
已完结
Basic Mechanisms of Threshold-Voltage Instability and Implications for Reliability Testing of SiC MOSFETs
5个月前
已完结
Forward bias degradation and thermal simulations of vertical geometry β-Ga2O3 Schottky rectifiers
6个月前
已完结
Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test
8个月前
已完结
Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging
8个月前
已完结
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