| 标题 |
Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Journal 作者:Y.-S. Zheng; Q. Guo; Y. Su; P. Foo 出版日期:2003-02-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)